Products

RF filters /
Antennas-LTCC


Low Temperature Co-fired Ceramics (LTCC) is a multilayer ceramic substrate technology. It is well suited for RF applications, and products where high integration level and/or high reliability is needed.

Click for the complete LTCC product line

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Ultra High Current Inductors

Molded, leaded, wound, and magnetically shielded Inductors for power line. Low copper loss for high power handling capability. Using large saturation induction of IRON metals and wide operating temperature ranges due to high Curie temperatures. Applications for desktop computers, High class graphics card, VRMs, etc.
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SMD Power Inductors

Surface Mount Power Inductors Include: MSCDRI, MSCD, MSCDB, MSCDRB, MSCH, and MLPS series.
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Multilayer Chip Beads


The GMLB Series is Mag.Layers’ line of high quality ferrite chip beads. Using the latest multilayer technology, we have developed chip beads that are able to resolve all EMI/EMC issues. High quality, reliability, and versatility make the GMLB series chip beads suitable for all your design needs.
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Multilayer Chip Inductors


Multilayer chip inductors are Mag.Layers’ line of high quality ferrite chip inductors and ceramic chip inductors. Base on our design , material and processing technology, we provide a wide ragne of inductance values for your low frequency applications, high frequency applications, and power line applications.
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EMI Common Mode Filters

The EMI filter is suitable for noise suppression by using Mag. Layers’ multilayer processing and circuit design technology.
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Wire Wound Leaded Inductors

The leaded type feature low DC resistance and high current handling capacities, making them ideal for power supply line applications.
Application to Televisions, VCRs, printer, and other electronic equipment
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Wire Wound Chip Inductors

The wire wound type inductors provide low DC resistance and are suitable for signal line and power line application.
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Quality Assurance


MAG.LAYERS's quality assurance activities achieve "Complete Customer Satisfaction" through the participation of all employees.
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Packaging
 

 

all specs presented in pdf format .

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